Description
IEC 60191-6-1 Ed. 1.0 en – Mechanical standardization of semiconductor devices – Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for gull-wing lead terminals
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
Product Details
- Edition:
- 1.0
- Published:
- 10/30/2001
- Number of Pages:
- 7
- File Size:
- 1 file , 230 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus