Description
IEC 60191-6-19 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
Product Details
- Edition:
- 1.0
- Published:
- 02/25/2010
- Number of Pages:
- 25
- File Size:
- 1 file , 1.5 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus