Description
IEC 60191-6-2 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Product Details
- Edition:
- 1.0
- Published:
- 12/11/2001
- Number of Pages:
- 21
- File Size:
- 1 file , 250 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus