Description
IEC 60191-6-21 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Product Details
- Edition:
- 1.0
- Published:
- 08/30/2010
- Number of Pages:
- 28
- File Size:
- 1 file , 420 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus