Description
IEC 60191-6-22 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Product Details
- Edition:
- 1.0
- Published:
- 12/11/2012
- Number of Pages:
- 34
- File Size:
- 1 file , 380 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus