IEC 60191-6-3 Ed. 1.0 en:2000

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Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
standard by International Electrotechnical Commission, 09/29/2000

Description

Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.

Product Details

Edition:
1.0
Published:
09/29/2000
Number of Pages:
17
File Size:
1 file , 180 KB
Note:
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