Description
IEC 60191-6-4 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Product Details
- Edition:
- 1.0
- Published:
- 06/11/2003
- Number of Pages:
- 32
- File Size:
- 1 file , 480 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
