IEC 60191-6-8 Ed. 1.0 b

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Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)

Published by Publication Date Number of Pages
IEC 08/27/2001 22

Description

IEC 60191-6-8 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Product Details

Edition:
1.0
Published:
08/27/2001
Number of Pages:
22
File Size:
1 file , 330 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus