Description
IEC 60191-6-8 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
Product Details
- Edition:
- 1.0
- Published:
- 08/27/2001
- Number of Pages:
- 22
- File Size:
- 1 file , 330 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus