IEC 60191-6-8 Ed. 1.0 en:2001

$37.00

Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)
standard by International Electrotechnical Commission, 08/27/2001

Description

Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.

Product Details

Edition:
1.0
Published:
08/27/2001
Number of Pages:
10
File Size:
1 file , 260 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus